NeuCool technology works with existing data center equipment and configuration.
Accelsius, a relative newcomer in the liquid cooling market, has launched its NeuCool dual-phase, direct-to-chip liquid cooling technology, which is designed to be deployed without having to do a massive retrofit of your data center.
Liquid cooling is a growing technology to address rising heat density in data centers – which traditional fans simply can’t handle anymore. Liquid cooling offers 3,000 times the heat absorption of air, but to roll it out in a data center requires either a massive retrofit, or building a whole new facility from scratch to handle things like piping and special equipment.
NeuCool fits into traditional racks ranging from the standard 42U size to more than 50U with no special rack mounting required. It especially benefits older systems, since most new servers being introduced into data centers today are preconfigured for deployment, and more and more are being sold with liquid cooling connectors.
For older air-cooled systems, the heat sinks and fans are replaced by NeuCool CPU and GPU Vaporators, which affix to the same location and footprint as the heat sinks and fans. The plumbing for vapor and liquid dielectric is also predetermined and integrated in advance. So, the new NeuCool Vaporators are integrated and validated prior to server deployments.
The vaporators (also called cold plates) are mounted directly to targeted hot-spot chips. An eco-friendly dielectric refrigerant is used to draw heat away from the chip, where it turns into a vapor. That vapor then travels through an industrial manifold to an intelligent Platform Control Unit (iPCU), condensing back into a liquid in a closed-loop system and returning to the vaporator for continued cooling.
The NeuCool architecture is heavily engineered to prevent leakage, which is a fear many people have when it comes to adopting liquid cooling. NeuCool’s modular design enables seamless integration into existing data center facilities and at the edge via water-cooled doors, dry coolers or other heat rejection methods.
Accelsius claims that its NeuCool two-phase, direct-to-chip, in-rack solution offers a solution for cooling challenges with an estimated 50% savings in energy costs, an 80% reduction in CO2 emissions, and zero water used when compared to air cooling.
The company is taking orders now, with deployments planned to begin later this month.
